Multi mode system with a dispersion x-ray detector

ABSTRACT

A method for evaluating a specimen, the method can include positioning an energy dispersive X-ray (EDX) detector at a first position; scanning a flat surface of the specimen by a charged particle beam that exits from a charged particle beam optics tip and propagates through an aperture of an EDX detector tip; detecting, by the EDX detector, x-ray photons emitted from the flat surface as a result of the scanning of the flat surface with the charged particle beam; after a completion of the scanning of the flat surface, positioning the EDX detector at a second position in which a distance between the EDX detector tip and a plane of the flat surface exceeds a distance between the plane of the flat surface and the charged particle beam optics tip; and wherein a projection of the EDX detector on the plane of the flat surface virtually falls on the flat surface when the EDX detector is positioned at the first position and when the EDX detector is positioned at the second position.

CROSS REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. application Ser. No.15/005,949, filed Jan. 25, 2016, the entire contents of which areincorporated herein by reference in their entirety for all purposes.

BACKGROUND

An energy dispersion x-ray detector (EDX) can be used for determining acomposition of a microscopic element. An energy dispersion x-raydetector collects x-ray photons emitted as a result of an illuminationof the microscopic element and generates an energy spectrum. Energyspectrum means any type of information about energy levels at differentwavelengths or frequencies along the spectrum. For example—the energyspectrum can be a histogram that displays the number of X-ray counts foreach x-ray energy level. Measuring X ray energies can help tocharacterize the element from which an x-ray photon was emitted.

The column that illuminates the microscopic element is proximate to theelement and has a relatively big tip. The big tip prevents the EDXdetector from being positioned in proximity of the microscopic elementand may also force the EDX detector to be positioned in an asymmetricalmanner in relation to the axis of illumination thereby providing apartial and asymmetrical angular coverage.

There is a growing need to improve the accuracy of EDX measurements.

SUMMARY

According to an embodiment of the invention a method for evaluating aspecimen is provided. The method can include positioning an energydispersive X-ray (EDX) detector at a first position; scanning a flatsurface of the specimen by a charged particle beam that exits from acharged particle beam optics tip and propagates through an aperture ofan EDX detector tip; detecting, by the EDX detector, x-ray photonsemitted from the flat surface as a result of the scanning of the flatsurface with the charged particle beam; after a completion of thescanning of the flat surface, positioning the EDX detector at a secondposition in which a distance between the EDX detector tip and a plane ofthe flat surface exceeds a distance between the plane of the flatsurface and the charged particle beam optics tip; and wherein aprojection of the EDX detector on the plane of the flat surfacevirtually falls on the flat surface when the EDX detector can bepositioned at the first position and when the EDX detector can bepositioned at the second position.

The method can include processing detection signals generated by the EDXdetector to provide estimated compositions of multiple points of theflat surface of the specimen.

The positioning of the EDX detector at the second position can includemoving the EDX detector along a first direction that can be parallel tothe flat surface of the specimen and along a second direction that canbe vertical to the flat surface of the specimen.

According to an embodiment of the invention there can be provided acharged particle beam system that can include (i) a controller, (ii) amovable stage that can be configured to support a specimen; (iii)charged particle beam optics that can include a charged particle beamoptics tip that can be configured to output a primary charged particlebeam; (iv) an electron detector; (v) an energy dispersive X-ray (EDX)detector; and (vi) an EDX detector motion module. The EDX detector caninclude an EDX detector tip that can include an aperture and a window.The EDX detector motion module can be configured to move the EDXdetector between a first position and a second position. The EDXdetector tip can be positioned between the charged particle beam opticstip and a flat surface of the specimen and the charged particle beampasses through the aperture when the EDX detector can be positioned atthe first position and the movable stage supports the specimen. Adistance between the EDX detector tip and the movable stage exceeds adistance between the movable stage and the charged particle beam opticstip when the EDX detector can be positioned at the second position. Aprojection of the EDX detector on a plane of the flat surface virtuallyfalls on the flat surface when the EDX detector can be positioned at thefirst position and when the EDX detector can be positioned at the secondposition.

The movable stage can be configured to follow a mechanical scan patternand the charged particle beam optics can be configured to deflect thecharged particle beam thereby scanning the flat surface of the specimen;and wherein x-ray photons emitted as a result of the scanning of thespecimen enter the window of the EDX detector tip and are detected by anx-ray sensitive element of the EDX detector.

The system can include a processor that can be configured to associatebetween points of the flat surface of the specimen that were illuminatedduring the scanning of the flat surface of the specimen and detectionsignals generated by the EDX detector.

The processor can be configured to evaluate compositions of the pointsof the flat surface of the specimen that were illuminated during thescanning of the specimen.

The EDX detector can include multiple windows that are positioned at aradial symmetry.

The EDX detector motion module can be configured to move the EDXdetector from the second position to the first position by movingdownwards and towards the charged particle optics tip a portion of theEDX detector.

The EDX detector can include an EDX detector amplifier and a EDXdetector conduit; and wherein the EDX detector conduit surrounds an EDXdetector conductor that can be coupled between a x-ray sensitive elementof the EDX detector and the EDX detector amplifier.

The system can include a specimen chamber; wherein the specimen chambercan include a chamber opening through which the EDX detector conduitpasses; wherein the chamber opening can be sealed by a bellows; andwherein the bellows surrounds the EDX conduit.

The EDX conduit can include an upper horizontal portion, a lowerhorizontal portion and a sloped intermediate portion that can beconnected between the upper horizontal portion and the lower horizontalportion.

The lower horizontal portion can be connected to the EDX detector tip.

The EDX detector amplifier can be positioned outside a specimen chamberand the EDX detector tip remains within the specimen chamber when theEDX detector can be positioned at the first position and when the EDXdetector can be positioned at the second position.

BRIEF DESCRIPTION OF THE DRAWINGS

The subject matter regarded as the invention is particularly pointed outand distinctly claimed in the concluding portion of the specification.The invention, however, both as to organization and method of operation,together with specimen s, features, and advantages thereof, can best beunderstood by reference to the following detailed description when readwith the accompanying drawings in which:

FIG. 1 illustrates a specimen and a charged particle beam systemaccording to an embodiment of the invention;

FIG. 2 is a cross sectional view of a charged particle beam system and aspecimen according to an embodiment of the invention;

FIG. 3 is a cross sectional view of a charged particle beam system and aspecimen according to an embodiment of the invention;

FIG. 4 includes a top view and a side view of a EDX detector accordingto an embodiment of the invention;

FIG. 5 illustrates an upper facet of a specimen chamber, an EDX detectormotion module, an EDX detector amplifier, an EDX detector conduit, aspecimen chamber opening and a column of charged particle beam opticsaccording to an embodiment of the invention;

FIG. 6 illustrates a portion of an upper facet of a specimen chamber, anEDX detector amplifier, an EDX detector conduit, bellows, and a specimenchamber opening according to an embodiment of the invention;

FIG. 7 illustrates a portion of an upper facet of a specimen chamber, anEDX detector amplifier, an EDX detector conduit, a cover, bellows, and aspecimen chamber opening according to an embodiment of the invention;

FIG. 8 illustrates a portion of an upper facet of a specimen chamber, anEDX detector amplifier, and EDX detector conduit and an EDX detector tipaccording to an embodiment of the invention; and

FIG. 9 illustrates a method according to an embodiment of the invention.

It will be appreciated that for simplicity and clarity of illustration,elements shown in the figures have not necessarily been drawn to scale.For example, the dimensions of some of the elements may be exaggeratedrelative to other elements for clarity. Further, where consideredappropriate, reference numerals may be repeated among the figures toindicate corresponding or analogous elements.

DETAILED DESCRIPTION

In the following detailed description, numerous specific details are setforth in order to provide a thorough understanding of the invention.However, it will be understood by those skilled in the art that thepresent invention can be practiced without these specific details. Inother instances, well-known methods, procedures, and components have notbeen described in detail so as not to obscure the present invention.

Because the illustrated embodiments of the present invention can for themost part, be implemented using electronic components and circuits knownto those skilled in the art, details will not be explained in anygreater extent than that considered necessary as illustrated above, forthe understanding and appreciation of the underlying concepts of thepresent invention and in order not to obfuscate or distract from theteachings of the present invention.

Any reference in the specification to a method should be applied mutatismutandis to a system capable of executing the method.

Any reference in the specification to a system should be applied mutatismutandis to a method that can be executed by the system.

FIG. 1 illustrates charged particle beam system 10 and specimen 100according to an embodiment of the invention.

The specimen 100 has a flat surface 105 that is scanned by the chargedparticle beam, system 10. Flat surface 105 is located within animaginary plane 106 that is referred to as the plane of the flatsurface. The flat surface 105 is flat in the sense that there up tonanometric scale height differences between different points of the flatsurface.

Charged particle beam system 10 is illustrated as being a chargedparticles imager such as but not limited to a scanning electronmicroscope (SEM) or an electron beam inspection system.

Charged particle beam system 10 includes controller 50, movable stage60, charged particle beam optics 40, EDX detector 200, EDX detectormotion module 250, specimen chamber 90, memory unit 70 and processor 20.

Controller 50 is configured to control the operation of at least some ofthe various components of charged particle beam system 10.

Movable stage 60 is configured to support specimen 100 and move specimenaccording to a mechanical scan pattern.

Charged particle beam optics 40 is configured to (a) generate a primarycharged particle beam 111, (b) deflect and otherwise direct the primarycharged particle beam 111 to exit through charged particle beam opticstip 43 to impinge on flat surface 105 of specimen 100, (c) detectelectrons that are emitted from flat surface 105.

In FIG. 1 the charged particle beam optics 40 is illustrated asincluding in-lens secondary electron detector 42 and in-lensbackscattered electron detector 44. It is noted that charged particlebeam optics 40 can include one or more electron out-lens electrondetector, can have only one or more secondary electron detector, caninclude only one or more backscattered electron detector or can includeany combination of electron detectors.

EDX detector motion module 250 is configured to move the EDX detector200 between a first position and a second position.

Specimen 100 can be a wafer, a micro-machined object, a solar panel andthe like. Specimen 100 can be relatively large (for example—have adiameter of 300 millimeters) and EDX detector, even when positioned atthe second position can be positioned directly above specimen 100.

Accordingly, the projection of the EDX detector 200 on plane 106virtually falls on specimen 100 when the EDX detector 200 is positionedat the first position and when the EDX detector is positioned at thesecond position.

EDX detector 200 includes EDX detector tip 210, EDX detector conduit 220and EDX detector amplifier 230. FIG. 1 illustrates EDX detector 200 asbeing positioned in a first position in which EDX detector tip 210 ispositioned between charged particle beam optics tip 43 and specimen 100.Primary charged particle beam 111 passes through an aperture formed inEDX detector tip 210. EDX detector conduit 220 passes through a specimenchamber opening 91.

When EDX detector 200 is positioned at the first position EDX, detectortip 210 is very close (for example—few tenths of nanometers) to flatsurface 105 and thus EDX detector 200 is able to detect x-ray photonsthat propagate within a large angular range that EDX detectors 200 thatare more distant from flat surface 105.

Furthermore—when placing windows on both sides of the aperture—the EDXdetector 200 can provide a symmetrical coverage of emitted x-rayphotons.

Movable stage 60 can follow a mechanical scan pattern and chargedparticle beam optics 40 can deflect primary charged particle beam 111thereby scanning flat surface 105.

X-ray photons emitted as a result of the scanning of flat surface 105enter the window of EDX detector tip 210 and are detected by an x-raysensitive element of the EDX detector. The x-ray sensitive element canbe a photodiode. The x-ray sensitive element generates detection signalsindicative of the detected x-ray photons. The detection signals are sentvia EDX detector conduit 220 to EDX detector amplifier 230 and can thenbe stored in memory unit 70 or processed by processor 20. It is notedthat the detection signals can be converted to digital detection signalsby EDX detector amplifier 230 or by an analog to digital converter thatdoes not belong to EDX detector amplifier 230.

Processor 20 can correlate or otherwise associate between points of thespecimen that were illuminated (by primary charged particle beam 111)during the scanning of flat surface 105 and detection signals generatedby the EDX detector.

Processor 20 can be configured to evaluate compositions of the points ofthe specimen that were illuminated during the scanning of the flatsurface 105.

FIG. 2 is a cross sectional view of charged particle beam system 10 andspecimen 100 according to an embodiment of the invention.

EDX detector amplifier 230 is positioned outside specimen chamber 90 andEDX detector tip 210 is positioned within specimen chamber 90—at leastwhen EDX detector 200 is positioned at the first position.

EDX detector tip 210 is coupled to EDX detector amplifier 230 via EDXdetector conduit 220. In FIG. 2 the EDX detector 200 is positioned at afirst position and the primary charged particle beam passes through anaperture formed in EDX detector tip 210.

EDX detector conduit 220 passes through specimen chamber opening 91.

Specimen 100 is supported by movable stage 60.

In order to maintain very low specimen chamber pressure the specimenchamber 90 should be sealed regardless of the position of the EDXdetector 200.

The sealing is obtained by including a cover 251 and bellows 252 thatsurround EDX detector conduit 220 and seal the EDX detector conduit 220and the specimen chamber 90 from the environment.

Bellows 252 is flexible and is connected between EDX detector amplifier230 and cover 251.

FIG. 3 is a cross sectional view of charged particle beam system 10 andspecimen 100 according to an embodiment of the invention.

FIG. 3 illustrates EDX detector 200 as being positioned in a secondposition in which EDX detector tip 210 is spaced apart from the chargedparticle beam optics tip 43 and the specimen 100. EDX detector tip 210does not interfere with any measurements performed by charged particlebeam optics 40.

When in the second position the distance (D2 102) between EDX detectortip 210 and the movable stage 60 exceeds the distance (D1 101) betweenthe movable stage and the charged particle beam optics tip 43 when theEDX detector is positioned at the second position.

The EDX detector 200 can be moved in various manners between the firstand second positions. For example, EDX detector 200 can be moved towardsthe first position by a downwards and leftward movement.

FIG. 4 includes a top view and a side view of EDX detector 200 accordingto an embodiment of the invention.

EDX detector tip 210 is coupled to EDX detector amplifier 230 via EDXdetector conduit 220.

EDX detector tip 210 is illustrates as including aperture 231 and window232. A primary charged particle beam can pass through aperture 231 whenEDX detector 200 is at a first position. X-ray photons emitted from thespecimen pass through window 232 and are detected by x-ray sensitiveelement 240 of EDX detector 200. The x-ray sensitive element 240 can beposition within EDX detector tip 210 but this is not necessarily so.

X-ray sensitive element 240 generates detection signals that are sent,via conductor 242 to EDX detector amplifier 230.

EDX detector conduit 220 is illustrated as including upper horizontalportion 221, lower horizontal portion 223 and sloped intermediateportion 222 that is connected between the upper horizontal portion 221and the lower horizontal portion 223.

EDX detector conduit 220 can be rigid or elastic. EDX detector conduit220 may have any shape or size.

FIG. 4 also illustrates an alternative configuration of EDX detector tip210—that includes multiple windows 232 and 233 that are arranged in asymmetrical manner on both sides of aperture 231.

FIG. 5 illustrates an upper facet 92 of specimen chamber, EDX detectormotion module 250, EDX detector amplifier 230, EDX detector conduit 220,specimen chamber opening 91 and a column 45 of charged particle beamoptics 40 according to an embodiment of the invention.

In FIG. 5 the EDX detector 200 is in a first position. Cover 251 andbellows 252 are not shown for simplicity of explanation.

EDX detector motion module 250 contacts the EDX detector amplifier 230and moves EDX detector amplifier 230 in order to change the position ofEDX detector 200.

FIG. 6 illustrates a portion of the upper facet 92 of specimen chamber,EDX detector amplifier 230, EDX detector conduit 220, bellows 252 andspecimen chamber opening 91 according to an embodiment of the invention.

In FIG. 6 the EDX detector 200 is in the first position. Cover 251 isnot shown for simplicity of explanation.

FIG. 7 illustrates a portion of the upper facet 92 of specimen chamber,EDX detector amplifier 230, EDX detector conduit 220, bellows 252, cover251 and specimen chamber opening 91 according to an embodiment of theinvention.

In FIG. 7 the EDX detector 200 is in the first position.

FIG. 8 illustrates a portion of an upper facet 92 of specimen chamber,EDX detector amplifier 230, EDX detector conduit 220 and EDX detectortip 210 according to an embodiment of the invention.

In FIG. 8 the EDX detector 200 is in a second position. Cover 251 andbellows 252 are not shown for simplicity of explanation.

FIG. 9 illustrates method 300 according to an embodiment of theinvention.

Method 300 can start by step 310 of positioning an energy dispersiveX-ray (EDX) detector at a first position.

Step 310 can be followed by step 320 of (i) scanning a flat surface of aspecimen by a charged particle beam that exits from a tip of a chargedparticle beam optics and propagates through an aperture of an EDX tip ofthe EDX detector; and (ii) detecting, by the EDX detector, x-ray photonsemitted from the flat surface as a result of the scanning of the flatsurface with the charged particle beam.

Step 320 can be followed by steps 330 and 340.

Step 330 can include positioning the EDX detector at a second positionin which a distance between the EDX detector tip and the plane of theflat surface exceeds a distance between the plane of the flat surfaceand the charged particle beam optics tip.

A projection of the EDX detector on a plane of the flat surfacevirtually falls on the flat surface when the EDX detector is positionedat the first position and when the EDX detector is positioned at thesecond position.

Step 340 can include processing detection signals generated by the EDXdetector to provide estimated compositions of multiple points of thespecimen.

In the foregoing specification, the invention has been described withreference to specific examples of embodiments of the invention. It will,however, be evident that various modifications and changes may be madetherein without departing from the broader spirit and scope of theinvention as set forth in the appended claims.

Moreover, the terms “front,” “back,” “top,” “bottom,” “over,” “under”and the like in the description and in the claims, if any, are used fordescriptive purposes and not necessarily for describing permanentrelative positions. It is understood that the terms so used areinterchangeable under appropriate circumstances such that theembodiments of the invention described herein are, for example, capableof operation in other orientations than those illustrated or otherwisedescribed herein.

The connections as discussed herein may be any type of connectionsuitable to transfer signals from or to the respective nodes, units ordevices, for example via intermediate devices. Accordingly, unlessimplied or stated otherwise, the connections may, for example, be directconnections or indirect connections. The connections may be illustratedor described in reference to being a single connection, a plurality ofconnections, unidirectional connections, or bidirectional connections.However, different embodiments can vary the implementation of theconnections. For example, separate unidirectional connections may beused rather than bidirectional connections and vice versa. Also,plurality of connections may be replaced with a single connection thattransfers multiple signals serially or in a time multiplexed manner.Likewise, single connections carrying multiple signals may be separatedout into various different connections carrying subsets of thesesignals. Therefore, many options exist for transferring signals.

Although specific conductivity types or polarity of potentials have beendescribed in the examples, it will be appreciated that conductivitytypes and polarities of potentials may be reversed.

Each signal described herein may be designed as positive or negativelogic. In the case of a negative logic signal, the signal is active lowwhere the logically true state corresponds to a logic level zero. In thecase of a positive logic signal, the signal is active high where thelogically true state corresponds to a logic level one. Note that any ofthe signals described herein may be designed as either negative orpositive logic signals. Therefore, in alternate embodiments, thosesignals described as positive logic signals can be implemented asnegative logic signals, and those signals described as negative logicsignals can be implemented as positive logic signals.

Furthermore, the terms “assert” or “set” and “negate” (or “deassert” or“clear”) are used herein when referring to the rendering of a signal,status bit, or similar apparatus into its logically true or logicallyfalse state, respectively. If the logically true state is a logic levelone, the logically false state is a logic level zero. And if thelogically true state is a logic level zero, the logically false state isa logic level one.

Those skilled in the art will recognize that the boundaries betweenlogic blocks are merely illustrative and that alternative embodimentscan merge logic blocks or circuit elements or impose an alternatedecomposition of functionality upon various logic blocks or circuitelements. Thus, it is to be understood that the architectures depictedherein are merely exemplary, and that in fact many other architecturesmay be implemented which achieve the same functionality.

Any arrangement of components to achieve the same functionality iseffectively “associated” such that the desired functionality isachieved. Hence, any two components herein combined to achieve aparticular functionality can be seen as “associated with” each othersuch that the desired functionality is achieved, irrespective ofarchitectures or intermedial components. Likewise, any two components soassociated can also be viewed as being “operably connected,” or“operably coupled,” to each other to achieve the desired functionality.

Furthermore, those skilled in the art will recognize that boundariesbetween the above described operations merely illustrative. The multipleoperations can be combined into a single operation, a single operationcan be distributed in additional operations and operations can beexecuted at least partially overlapping in time. Moreover, alternativeembodiments can include multiple instances of a particular operation,and the order of operations can be altered in various other embodiments.

Also for example, in one embodiment, the illustrated examples can beimplemented as circuitry located on a single integrated circuit orwithin a same device. Alternatively, the examples can be implemented asany number of separate integrated circuits or separate devicesinterconnected with each other in a suitable manner.

Also for example, the examples, or portions thereof, can implemented assoft or code representations of physical circuitry or of logicalrepresentations convertible into physical circuitry, such as in ahardware description language of any appropriate type.

However, other modifications, variations and alternatives are alsopossible. The specifications and drawings are, accordingly, to beregarded in an illustrative rather than in a restrictive sense.

In the claims, any reference signs placed between parentheses shall notbe construed as limiting the claim. The word ‘comprising’ does notexclude the presence of other elements or steps then those listed in aclaim. Furthermore, the terms “a” or “an,” as used herein, are definedas one or more than one. Also, the use of introductory phrases such as“at least one” and “one or more” in the claims should not be construedto imply that the introduction of another claim element by theindefinite articles “a” or “an” limits any particular claim containingsuch introduced claim element to inventions containing only one suchelement, even when the same claim includes the introductory phrases “oneor more” or “at least one” and indefinite articles such as “a” or “an.”The same holds true for the use of definite articles. Unless statedotherwise, terms such as “first” and “second” are used to arbitrarilydistinguish between the elements such terms describe. Thus, these termsare not necessarily intended to indicate temporal or otherprioritization of such elements. The mere fact that certain measures arerecited in mutually different claims does not indicate that acombination of these measures cannot be used to advantage.

While certain features of the invention have been illustrated anddescribed herein, many modifications, substitutions, changes, andequivalents will now occur to those of ordinary skill in the art. It is,therefore, to be understood that the appended claims are intended tocover all such modifications and changes as fall within the true spiritof the invention.

1.-14. (canceled)
 15. A charged particle beam system, comprising: acontroller; a movable stage configured to support a specimen; chargedparticle beam optics having a charged particle beam optics tipconfigured to output a primary charged particle beam; a detectorcomprising a detector tip that includes an aperture, the detector alsoincluding an amplifier and a conduit, the conduit surrounding aconductor that is coupled between a sensor element of the detector andthe amplifier, wherein the conduit comprises an upper portion, a lowerportion positioned below the upper portion and extending substantiallyparallel to the upper portion, and an intermediate portion coupledbetween the upper portion and the lower portion; and a detector motionmodule configured to move the detector between a first position and asecond position; wherein, when the detector is positioned at the firstposition and the movable stage supports the specimen, the detector tipis positioned between the charged particle beam optics tip and a surfaceof the specimen, and the aperture of the detector tip is aligned with apath of the primary charged particle beam; and wherein, when thedetector is positioned at the second position, a distance between thedetector tip and the movable stage exceeds a distance between thecharged particle beam optics tip and the movable stage.
 16. The systemof claim 15 wherein the sensor element is disposed within the detectortip, and the detector tip comprises at least one window disposed betweenthe sensor element and the movable stage.
 17. The system of claim 15wherein the movable stage is configured to follow a mechanical scanpattern, and the charged particle beam optics is configured to deflectthe primary charged particle beam thereby scanning the surface of thespecimen.
 18. The system of claim 15 wherein the detector tip comprisesmultiple windows that are positioned at a radial symmetry around theaperture.
 19. The system of claim 15 wherein the detector motion moduleis configured to move the detector from the second position to the firstposition by moving the detector tip downwards and towards the chargedparticle optics tip.
 20. The system of claim 15 further comprising aspecimen chamber having a opening through which the conduit passes,wherein the opening is sealed by a bellows that surrounds a portion ofthe conduit.
 21. The system of claim 15 wherein the lower portion of theconduit is coupled to the detector tip.
 22. The system of claim 15wherein the amplifier is positioned outside a specimen chamber and thedetector tip is positioned within the specimen chamber.
 23. The systemof claim 15 wherein the sensor element is configured to detect x-rayphotons emitted from the surface of the specimen during scanning. 24.The system of claim 15 wherein the sensor element is configured todetect electrons emitted from the surface of the specimen duringscanning.
 25. The system of claim 15 further comprising a processorconfigured to associate points of the surface of the specimen that areilluminated during scanning with detection signals generated by thedetector.
 26. The system of claim 25 wherein the processor is configuredto evaluate compositions of the points of the surface of the specimenthat are illuminated during scanning.
 27. A method for evaluating aspecimen, comprising: positioning a detector at a first position, thedetector including an amplifier and a conduit, the conduit surrounding aconductor that is coupled between a sensor element of the detector andthe amplifier, wherein the conduit comprises an upper portion, a lowerportion positioned below the upper portion and extending substantiallyparallel to the upper portion, and an intermediate portion coupledbetween the upper portion and the lower portion, and with the detectorat the first position: scanning a surface of the specimen using acharged particle beam that exits from a charged particle beam optics tipand propagates through an aperture located at a tip of the detector;thereafter, positioning the detector at a second position in which adistance between the tip of the detector and the surface of the specimenexceeds a distance between the charged particle beam optics tip and thesurface of the specimen.
 28. The method of claim 27 further comprisingprocessing detection signals generated by the detector to provideestimated compositions of the surface of the specimen.
 29. The method ofclaim 27 wherein positioning the detector at the second positioncomprises moving the tip of the detector along a first direction that issubstantially parallel to the surface of the specimen and along a seconddirection that is substantially perpendicular to the surface of thespecimen.
 30. The method of claim 27 further comprising detecting, bythe sensor element of the detector, x-ray photons emitted from thesurface of the specimen during scanning.
 31. A charged particle beamsystem, comprising: a controller; a movable stage configured to supporta specimen; charged particle beam optics that comprises a chargedparticle beam optics tip configured to output a primary charged particlebeam; a detector comprising a detector tip that includes an aperture,the detector also including an amplifier and a conduit, the conduitsurrounding a conductor that is coupled between a sensor element of thedetector and the amplifier, wherein the conduit comprises an upperportion, a lower portion positioned below the upper portion andextending substantially parallel to the upper portion, and anintermediate portion that is coupled between the upper portion and thelower portion, wherein the intermediate portion does not extend parallelto the upper portion and the lower portion; and a detector motion moduleconfigured to move the detector between a first position and a secondposition; wherein, when the detector is positioned at the first positionand the movable stage supports the specimen, the detector tip ispositioned between the charged particle beam optics tip and a surface ofthe specimen, and the aperture of the detector is aligned with a path ofthe primary charged particle beam; and wherein, when the detector ispositioned at the second position, a distance between the detector tipand the movable stage exceeds a distance between the charged particlebeam optics tip and the movable stage.
 32. The system of claim 31wherein the detector motion module is configured to move the detectorfrom the second position to the first position by moving the detectortip downwards and towards the charged particle optics tip.
 33. Thesystem of claim 31 further comprising a specimen chamber having anopening through which the conduit passes, wherein the opening is sealedby a bellows that surrounds a portion of the conduit.
 34. The system ofclaim 31 wherein the lower portion of the conduit is coupled to thedetector tip.